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Tungsten Sputtering Targets

Tungsten Sputtering Targets

Tungsten Sputtering Targets
Product No NRE-43588
CAS No. 7440-33-7
Formula W
Molecular Weight 183.85
Purity >99.9%
Density 19.3 g/cm3
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Tungsten Sputtering Targets

Introduction:

Tungsten sputtering targets is a dense, hard metal known for its exceptional melting point, high tensile strength, and excellent thermal and electrical conductivity. These properties make tungsten an ideal material for various industrial applications, especially in environments that demand durability and heat resistance. Sputtering targets made from tungsten are used in physical vapor deposition (PVD) processes to produce thin films with specific characteristics, essential for modern technology.

Applications

Semiconductor Devices: Tungsten is commonly used as a contact and interconnect material in semiconductor fabrication. Its excellent conductivity helps in creating low-resistance connections between different layers of circuits.

Thin Film Coatings: Tungsten sputtering targets are used to produce thin film coatings for tools, medical devices, and various components, enhancing their hardness, wear resistance, and corrosion resistance.

Aerospace Components: The high melting point and strength of tungsten make it suitable for aerospace applications, where components are subjected to extreme conditions.

Electrical Contacts: Tungsten is often utilized in the production of electrical contacts due to its high conductivity and resistance to arcing and erosion.

Optical Coatings: Tungsten can be used in optical applications to produce reflective coatings for mirrors and lenses, improving their performance.

Surface Treatments: Tungsten coatings can enhance surface properties such as toughness and wear resistance, making them ideal for industrial applications.

 

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