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Niobium Silicide Sputtering Targets

Niobium Silicide Sputtering Targets

Niobium Silicide Sputtering Targets
Product No NRE-43528
CAS No. NA
Formula Nb5Si3
Molecular Weight 149.08
Purity >99.9%
Density NA
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Niobium Silicide Sputtering Targets

Introduction:

Niobium silicide sputtering targets is a compound formed from niobium and silicon, notable for its high melting point, excellent thermal stability, and good electrical conductivity. As a refractory material, it is of significant interest in various advanced applications, particularly in the fields of electronics, aerospace, and materials science. Sputtering is an effective method for depositing thin films of niobium silicide onto substrates, allowing for the development of coatings with tailored properties.

Applications:

High-Temperature Applications: NbSi₂ is characterized by its thermal stability, making it suitable for high-temperature environments, such as those found in aerospace components, gas turbines, and furnace elements.

Electrical Contacts and Interconnects: Due to its good electrical conductivity, niobium silicide can be used in electrical contacts and interconnects in microelectronics, contributing to the reliability and performance of electronic devices.

Wear-Resistant Coatings: The hardness and thermal resistance of NbSi₂ make it an excellent choice for wear-resistant coatings on cutting tools, molds, and machinery components, extending their lifespan and improving performance in harsh conditions.

Superconducting Applications: NbSi₂ has potential applications in superconducting materials, particularly in the fabrication of superconducting wires and films. Its unique properties can enhance the performance of superconducting circuits.

Thin-Film Transistors: In the semiconductor industry, NbSi₂ can be explored for use in thin-film transistors, where its electrical properties can be leveraged for improved performance in electronic devices.

Composite Materials: Niobium silicide can be integrated into composite materials to improve mechanical strength and thermal stability, making it suitable for advanced engineering applications.

 

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