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Nickel Boron Alloy Sputtering Targets

Nickel Boron Alloy Sputtering Targets

Nickel Boron Alloy Sputtering Targets
Product No NRE-43516
CAS No. NA
Formula Ni-B
Molecular Weight NA
Purity >99.9%
Density NA
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Nickel Boron Alloy Sputtering Targets

Introduction

Nickel boron alloy sputtering targets are composite materials consisting primarily of nickel (Ni) and boron (B). These alloys are known for their enhanced hardness, wear resistance, and unique electrical properties. Nickel boron alloys are typically used in the deposition of thin films via physical vapor deposition (PVD) techniques, which allow for precise control over film thickness and composition. Due to their beneficial characteristics, these sputtering targets find applications in various advanced technological fields.

Applications:

Hard Coatings:

Nickel boron alloys are widely used to create hard coatings for tools and machinery. These coatings enhance wear resistance, extend the life of components, and improve overall performance in demanding environments.

Magnetic Materials:

The unique magnetic properties of nickel boron alloys make them suitable for applications in magnetic sensors and devices, which are critical in data storage and electronic applications.

Surface Engineering:

Nickel boron alloy coatings can significantly improve the surface properties of substrates, providing increased hardness, corrosion resistance, and fatigue strength.

Electrocatalysis:

Due to their electrical conductivity and stability, nickel boron alloys are explored for use in electrocatalytic applications, including fuel cells and batteries, where efficient charge transfer is crucial.

Research and Development:

These sputtering targets are utilized in research settings to study the properties and potential applications of nickel boron alloys in materials science and nanotechnology.

Thermal Management:

Nickel boron coatings can be applied in thermal management applications, helping to improve heat dissipation in electronic devices and components.

 

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