Lutetium Oxide Sputtering Targets
Lutetium Oxide Sputtering Targets
Lutetium Oxide Sputtering Targets | |
Product No | NRE-43487 |
CAS No. | 12032-20-1 |
Formula | Lu2O3 |
Molecular Weight | 397.93 |
Purity | >99.9% |
Density | NA |
Thickness | 3 mm ± 0.5mm (can be customized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Conductivity | NA |
Lutetium Oxide Sputtering Targets
Introduction
Lutetium oxide (Lu2O3) is a rare earth compound with a range of unique properties that make it suitable for various advanced applications, particularly in the fields of electronics, optics, and materials science. As a sputtering target, lutetium oxide is utilized in thin-film deposition processes to create high-quality films for various technological applications.
Properties of Lutetium Oxide
High Purity: Lutetium oxide can be produced with high purity, which is essential for electronic and optical applications.
High Refractive Index: It exhibits a high refractive index, making it valuable for optical coatings and components.
Thermal Stability: Lutetium oxide is thermally stable, allowing it to withstand high-temperature processing conditions.
Electrical Insulator: It serves as a good insulator, making it useful in semiconductor applications.
Applications
Optical Coatings: Used in the production of anti-reflective coatings, lenses, and mirrors to enhance performance in optical devices.
Semiconductor Industry: Lutetium oxide can be applied in the fabrication of thin films for semiconductors, particularly in gate dielectrics and insulating layers.
Phosphors: It is often used in the manufacture of phosphor materials for lighting and display technologies.
Luminescent Materials: Due to its luminescent properties, it can be used in various optoelectronic devices.
Magnetic Applications: Lutetium oxide is also explored in the context of magnetic materials and devices.
Sputtering Process
In sputtering, a target material (in this case, lutetium oxide) is bombarded with energetic particles, causing atoms to be ejected from the target surface. These ejected atoms then deposit onto a substrate, forming a thin film. The control over film thickness, composition, and microstructure makes sputtering a preferred method for thin-film deposition.