Our Products

Lead Sputtering Target (Pb, Purity: 99.99%)

Lead Sputtering Target

Lead Sputtering Target
Product No NRE-43085
CAS No. 7439-92-1
Formula Pb
Molecular Weight 207.2 g/mol
Purity >99.9%
Density 11.34 g/cm³
Thickness 3 mm ± 0.5mm (can be suctomized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Expansion NA

Lead Sputtering Target

Introduction

Lead sputtering target is a heavy metal known for its excellent conductivity, malleability, and corrosion resistance. In sputtering processes, lead sputtering targets are used to deposit thin films of lead onto various substrates through physical vapor deposition (PVD). These films exhibit valuable properties that make them useful in several applications across different industries.

Applications

Electronics: Lead is commonly used in the fabrication of electronic components, such as capacitors and resistors. Lead films can improve electrical conductivity and performance in circuit boards.

Optical Coatings: Lead can be used to create coatings that enhance the optical properties of lenses and mirrors. These coatings can be tailored for specific wavelengths, improving performance in optical systems.

Soldering Materials: Lead is a primary component in many solder alloys, particularly in electronics. Sputtered lead films can be used in soldering applications where reliable electrical connections are required.

Radiation Shielding: Due to its high density, lead is effective at attenuating various forms of radiation. Sputtered lead films can be applied in medical and industrial applications for radiation shielding.

Thin Film Batteries: Lead can be used in certain battery technologies, such as lead-acid batteries. Sputtering allows for the precise deposition of lead films to enhance battery performance and longevity.

Corrosion-Resistant Coatings: Lead coatings can provide protection against corrosion in various environments, extending the lifespan of components in harsh conditions.

 

error: