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CZ Silicon Wafers P Type Boron

CZ Silicon Wafers P Type Boron

CZ Silicon Wafers P-Type Boron
Product No NRE-44008
Type P-Type
Formula NA
Oxygen Contents (ppma) 12.5-16.5 ppma
Oxygen Contents 12.5-16.5
Thickness 275 μm
Diameter (mm) 3” (76.2mm)
Doping Boron
Resistivity 1-10ohm-cm
RRG (%) ≤12 %

CZ Silicon Wafers P Type Boron

Introduction:

CZ silicon wafers p type are widely used in the semiconductor industry due to their high purity and excellent crystallinity. P-type boron-doped CZ silicon wafers are specifically treated with boron to create “holes” in the silicon lattice, enabling the conduction of positive charge carriers. This doping process results in a material that is crucial for various electronic and optoelectronic applications.

Properties

Doping Element: Boron is a trivalent element that, when introduced into the silicon lattice, creates holes that facilitate electrical conductivity.

P-Type Conductivity: Characterized by a higher concentration of holes compared to electrons, allowing for effective charge transport.

High Purity and Uniformity: CZ wafers have low defect densities, making them suitable for high-performance applications.

Applications

Integrated Circuits (ICs): Used in the fabrication of various semiconductor devices, including microprocessors, memory chips, and analog components.

Solar Cells: P-type wafers are critical for forming p-n junctions in photovoltaic cells, which are essential for converting sunlight into electricity.

Transistors: Integral in the manufacturing of bipolar junction transistors (BJTs), which amplify electrical signals and switch currents.

Diodes: Employed in the production of various diodes, including rectifiers and light-emitting diodes (LEDs), utilizing their p-n junction properties.

Sensors: Used in temperature, pressure, and gas sensors, benefiting from the sensitivity and stability of P-type silicon.

MEMS Devices: Utilized in microelectromechanical systems for applications in automotive, medical, and consumer electronics sectors.

 

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