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Copper Sputtering Targets

Copper Sputtering Targets

Copper Sputtering Targets
Product No NRE-43383
CAS No. 7440-50-8
Formula Cu
Molecular Weight 63.55
Purity >99.9%
Density 8.96 g/cm³
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Conductivity NA

Copper Sputtering Targets

Copper sputtering targets are versatile and used in various applications beyond the ones previously mentioned. Here are some additional and specific applications where copper sputtering targets play a crucial role.

 Printed Circuit Boards (PCBs)

Application: Copper sputtering is used to deposit conductive layers on PCBs. The thin copper films help in forming the electrical connections between different components on the board.

Benefit: Ensures high conductivity and reliability of electrical signals on the PCB.

Magnetic Sensors and Devices

Application: Copper is used in the fabrication of thin film sensors and magnetic devices, including Hall Effect sensors and inductive sensors.

Benefit: Provides precise and stable magnetic and electrical properties.

 MEMS (Micro-Electro-Mechanical Systems)

Application: Copper sputtering is employed in the production of MEMS devices, which are used in a range of applications from automotive sensors to consumer electronics.

Benefit: Contributes to the miniaturization and functionality of MEMS devices through precise deposition of copper layers.

RF (Radio Frequency) Devices

Application: In RF devices, copper sputtering targets are used to deposit conductive layers on substrates that are part of antennas and other RF components.

Benefit: Ensures efficient signal transmission and reception in RF communication systems.

High-Performance Computing (HPC)

Application: Copper sputtering is used to deposit layers in high-performance computing components, including processors and high-speed interconnects.

Benefit: Enhances the performance and speed of computing systems by improving electrical conductivity.

Wear-Resistant Coatings

Application: Copper sputtering targets are used to apply coatings that improve the wear resistance of mechanical components, such as bearings and gears.

Benefit: Extends the lifespan and durability of components subjected to friction and wear.

Battery Technologies

Application: In advanced battery technologies, copper is used in the fabrication of current collectors and other components. Sputtering helps in creating uniform and high-quality copper films.

Benefit: Improves the efficiency and performance of batteries, including lithium-ion batteries.

Electroplating and Surface Finishing

Application: Copper sputtering is sometimes used as a preparatory step before electroplating processes or surface finishing techniques.

Benefit: Provides a uniform and adherent base layer that enhances the quality of subsequent coatings or finishes.

 

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