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Copper Single Crystal Substrates

Copper Single Crystal Substrates

Copper Single Crystal Substrates
Product No NRE-450120-1
CAS 7440-50-8
Purity >99.99% (oxygen < 80 ppm)
Material Cu-<100>,/<111>,/<110>
Dimensions 10x10x0.5
Cu Single Substrate Orientation <100>,/<111>,/<110>
Structure Cubic
Thickness 0.5 mm
Polished Single Side Polished
Orientation +/-2°

Copper Single Crystal Substrates

Introduction:

Copper single crystal substrates are highly pure and homogenous materials characterized by a uniform crystal structure throughout the substrate. This uniformity offers exceptional electrical and thermal conductivity, making them valuable in various applications within the electronics and materials science fields.

Applications

Electronic Devices:

Cu are used in the fabrication of high-performance electronic devices, including transistors and integrated circuits, where superior electrical conductivity is essential.

Interconnects in Microelectronics:

They serve as interconnect materials in semiconductor devices, providing reliable pathways for electrical signals and enhancing overall device performance.

Thin Film Deposition:

Cu are often used in thin film deposition processes, where their smooth surfaces and consistent crystallographic orientation improve film quality and adhesion.

Photonics and Optoelectronics:

These substrates are employed in optoelectronic applications, such as light-emitting diodes (LEDs) and laser diodes, where high thermal conductivity is required for efficient heat dissipation.

Materials Research:

In materials science, copper single crystal substrates are utilized for fundamental studies of crystallography, electron behavior, and the effects of surface modifications on material properties.

Catalysis:

Due to their high surface area and reactivity, copper single crystal substrates are investigated in catalysis research, particularly for reactions involving gas-solid interactions.

Surface Science Experiments:

They are valuable in surface science studies, allowing researchers to explore phenomena such as adsorption, surface diffusion, and chemical reactions on well-defined surfaces.

MEMS Devices:

Cu can be used in the fabrication of Microelectromechanical Systems (MEMS), where their mechanical properties contribute to device performance.

 

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