Boron sputtering target bonded with Indium
Boron sputtering target bonded with Indium
Boron sputtering target bonded with Indium | |
Product No | NRE-43631 |
CAS No. | NA |
Formula | NA |
Molecular Weight | NA |
Purity | >99.9% |
Density | NA |
Thickness | 3 mm ± 0.5mm (can be customized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Conductivity | NA |
Boron sputtering target bonded with Indium
Boron sputtering targets bonded with indium are a specialized configuration where indium is used as a bonding layer between the boron target and its backing plate or substrate. This setup can offer enhanced performance and durability in sputtering applications. Here’s a look at the different applications and benefits of using boron sputtering targets bonded with indium.
Semiconductor Processing
Doping Layers: In semiconductor manufacturing, boron is used as a dopant in silicon wafers. Indium bonding helps ensure good thermal and electrical contact between the boron target and the sputtering system, enhancing the efficiency and consistency of boron film deposition.
Optical Coatings
High-Quality Coatings: For applications requiring precise optical coatings, such as anti-reflective coatings on lenses and mirrors, a stable and uniform sputtering target is crucial. Indium bonding can help maintain the integrity of the target and improve the quality of the deposited film.
Wear-Resistant Coatings
Durability: Boron-based coatings are known for their hardness and resistance to wear. Indium bonding can improve the thermal and mechanical stability of the boron sputtering target, which is important for applications requiring high-performance wear-resistant coatings on tools and machinery.
Thermal Barrier Coatings
Heat Resistance: In high-temperature applications, such as in aerospace or industrial environments, the combination of boron and indium can provide effective thermal barrier coatings. The indium bonding layer helps in achieving a stable and uniform deposition process, which is essential for protecting components from extreme temperatures.
Nuclear Applications
Neutron Absorption: Boron is used for its neutron-absorbing properties in nuclear reactors. Indium bonding ensures that the boron target performs consistently over its lifespan, which is critical for applications such as neutron control rods and shielding.
Battery Technologies
Electrode Coatings: In battery technology, boron sputtering targets can be used to deposit coatings on electrodes to enhance their performance. Indium bonding helps maintain the structural integrity of the sputtering target, leading to more reliable and consistent coating processes.
Magnetic Materials
Magnetic Thin Films: For applications requiring magnetic thin films, such as sensors or magnetic recording media, the use of boron sputtering targets bonded with indium can ensure stable and uniform film deposition, improving the performance of the magnetic materials.