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Boron Doped P Type Silicon Wafer

Boron Doped P Type Silicon Wafer
Product No NRE-44003
Type P-type
Formula Si
Crystal method CZ
Purity NA
Thickness 250-500μm
Diameter (mm) 4” (101.6mm)
Doping Boron
Resistivity 1-10ohm-cm
RRG (%) ≤12
Oxygen Contents (ppma) 12.5-16.5

Boron Doped P Type Silicon Wafer

Introduction:

Boron doped P type silicon wafer are crucial materials in the semiconductor industry, characterized by their doping with boron atoms. This process creates “holes,” or positive charge carriers, in the silicon crystal lattice, enabling effective conduction of electricity. P-type silicon is commonly used in various electronic and optoelectronic devices due to its distinct electrical properties.

Properties

Doping Element: Boron is a trivalent element that, when introduced into the silicon lattice, creates holes by accepting electrons.

Electrical Conductivity: P-type silicon exhibits increased hole concentration, making it suitable for applications where positive charge carriers are needed.

Crystal Structure: Typically produced as single crystal wafers using methods like Czochralski or Float Zone to ensure high purity and uniformity.

Applications

Integrated Circuits (ICs): Widely used in the fabrication of various semiconductor devices, including microcontrollers and amplifiers.

Solar Cells: P-type wafers are often employed in photovoltaic cells, where they work in conjunction with N-type materials to form p-n junctions, essential for converting sunlight into electricity.

Transistors: Form the basis of bipolar junction transistors (BJTs), which are crucial for signal amplification and switching applications.

Diodes: Used in the production of various diodes, including rectifiers and light-emitting diodes (LEDs), leveraging their p-n junction properties.

MEMS Devices: Employed in microelectromechanical systems for sensors and actuators across various industries.

Sensors: Common in various sensor technologies, including temperature sensors and gas sensors.

 

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