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Copper Sputtering Target (Cu, Purity: 99.99%)

Copper Sputtering Target

Copper Sputtering Target
Product No NRE-43042
CAS No. 7440-50-8
Formula Cu
Molecular Weight 63.547 g/mol
Purity 99.99%
Density 8.96 g/cm³
Thickness 3 mm ± 0.5mm (can be customized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Expansion NA

Copper Sputtering Target

Copper sputtering targets have a range of specialized applications that extend across different industries. Here’s a deeper dive into some unique and less commonly discussed applications.

Flexible Electronics

Application: Copper sputtering is used to deposit conductive layers on flexible substrates, such as those used in flexible displays, wearable electronics, and flexible sensors.

Benefit: Enables the creation of electronics that are lightweight, bendable, and adaptable to various surfaces.

Thermal Management

Application: Copper films deposited through sputtering are used in thermal management solutions, such as heat spreaders and thermal interface materials.

Benefit: Enhances heat dissipation in electronic devices, improving reliability and performance.

Transparent Conductors

Application: Copper sputtering is sometimes used to create thin layers of copper in transparent conductive films for applications like touchscreens and displays.

Benefit: Provides high electrical conductivity while maintaining transparency for display and touch sensitivity.

 Quantum Computing

Application: In the fabrication of quantum computing devices, copper sputtering is used to create precise, thin films required for superconducting qubits and other components.

Benefit: Contributes to the high precision and performance needed for quantum computing applications.

Anti-Corrosion Coatings

Application: Copper sputtering can be used to apply coatings that protect underlying materials from corrosion, particularly in environments where traditional coatings might fail.

Benefit: Provides enhanced durability and protection for metals exposed to harsh conditions.

Optical Metamaterials

Application: Copper sputtering is used to fabricate layers for optical metamaterials that manipulate electromagnetic waves in innovative ways.

Benefit: Enables the development of advanced optical devices with unique properties such as cloaking or superlensing.

Magnetic Thin Films

Application: Copper sputtering targets are used to deposit magnetic thin films for applications in magnetic storage media, such as hard drives and magnetic random-access memory (MRAM).

Benefit: Enhances the performance and storage capacity of magnetic data storage devices.

 Photonics and Plasmonics

Application: In photonics and plasmonics, copper films are used to create structures that interact with light at the nanoscale, such as plasmonic sensors or light-guiding devices.

Benefit: Advances the development of high-performance photonic devices and sensors.

 

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