Copper Sputtering Target (Cu, Purity: 99.99%)
Copper Sputtering Target
Copper Sputtering Target | |
Product No | NRE-43042 |
CAS No. | 7440-50-8 |
Formula | Cu |
Molecular Weight | 63.547 g/mol |
Purity | 99.99% |
Density | 8.96 g/cm³ |
Thickness | 3 mm ± 0.5mm (can be customized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Expansion | NA |
Copper Sputtering Target
Copper sputtering targets have a range of specialized applications that extend across different industries. Here’s a deeper dive into some unique and less commonly discussed applications.
Flexible Electronics
Application: Copper sputtering is used to deposit conductive layers on flexible substrates, such as those used in flexible displays, wearable electronics, and flexible sensors.
Benefit: Enables the creation of electronics that are lightweight, bendable, and adaptable to various surfaces.
Thermal Management
Application: Copper films deposited through sputtering are used in thermal management solutions, such as heat spreaders and thermal interface materials.
Benefit: Enhances heat dissipation in electronic devices, improving reliability and performance.
Transparent Conductors
Application: Copper sputtering is sometimes used to create thin layers of copper in transparent conductive films for applications like touchscreens and displays.
Benefit: Provides high electrical conductivity while maintaining transparency for display and touch sensitivity.
Quantum Computing
Application: In the fabrication of quantum computing devices, copper sputtering is used to create precise, thin films required for superconducting qubits and other components.
Benefit: Contributes to the high precision and performance needed for quantum computing applications.
Anti-Corrosion Coatings
Application: Copper sputtering can be used to apply coatings that protect underlying materials from corrosion, particularly in environments where traditional coatings might fail.
Benefit: Provides enhanced durability and protection for metals exposed to harsh conditions.
Optical Metamaterials
Application: Copper sputtering is used to fabricate layers for optical metamaterials that manipulate electromagnetic waves in innovative ways.
Benefit: Enables the development of advanced optical devices with unique properties such as cloaking or superlensing.
Magnetic Thin Films
Application: Copper sputtering targets are used to deposit magnetic thin films for applications in magnetic storage media, such as hard drives and magnetic random-access memory (MRAM).
Benefit: Enhances the performance and storage capacity of magnetic data storage devices.
Photonics and Plasmonics
Application: In photonics and plasmonics, copper films are used to create structures that interact with light at the nanoscale, such as plasmonic sensors or light-guiding devices.
Benefit: Advances the development of high-performance photonic devices and sensors.