Lead Sputtering Target (Pb, Purity: 99.99%)
Lead Sputtering Target
Lead Sputtering Target | |
Product No | NRE-43085 |
CAS No. | 7439-92-1 |
Formula | Pb |
Molecular Weight | 207.2 g/mol |
Purity | >99.9% |
Density | 11.34 g/cm³ |
Thickness | 3 mm ± 0.5mm (can be suctomized) |
Diameter | 50 mm ± 1mm (can be customized) |
Shape | Round |
Resistivity | NA |
Thermal Expansion | NA |
Lead Sputtering Target
Introduction
Lead sputtering target is a heavy metal known for its excellent conductivity, malleability, and corrosion resistance. In sputtering processes, lead sputtering targets are used to deposit thin films of lead onto various substrates through physical vapor deposition (PVD). These films exhibit valuable properties that make them useful in several applications across different industries.
Applications
Electronics: Lead is commonly used in the fabrication of electronic components, such as capacitors and resistors. Lead films can improve electrical conductivity and performance in circuit boards.
Optical Coatings: Lead can be used to create coatings that enhance the optical properties of lenses and mirrors. These coatings can be tailored for specific wavelengths, improving performance in optical systems.
Soldering Materials: Lead is a primary component in many solder alloys, particularly in electronics. Sputtered lead films can be used in soldering applications where reliable electrical connections are required.
Radiation Shielding: Due to its high density, lead is effective at attenuating various forms of radiation. Sputtered lead films can be applied in medical and industrial applications for radiation shielding.
Thin Film Batteries: Lead can be used in certain battery technologies, such as lead-acid batteries. Sputtering allows for the precise deposition of lead films to enhance battery performance and longevity.
Corrosion-Resistant Coatings: Lead coatings can provide protection against corrosion in various environments, extending the lifespan of components in harsh conditions.