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Boron Doped Silicon Wafer

Boron Doped Silicon Wafer
Product No NRE-44004
Type P-type
Formula B-Si
Crystal method CZ
Purity NA
Thickness 250-500μm
Diameter (mm) 2” (50.8mm)
Doping Boron
Resistivity 1-10ohm-cm
RRG (%) ≤12
Oxygen Contents (ppma) 12.5-16.5

Boron Doped Silicon Wafer

Introduction:

Boron doped silicon wafer are a crucial component in the semiconductor industry. Doping silicon with boron, a trivalent element, creates P-type silicon, which has an abundance of holes (positive charge carriers). This alteration in the electrical properties of silicon makes it suitable for a wide range of applications in electronic and optoelectronic devices.

Properties

Doping Mechanism: Boron atoms replace some silicon atoms in the crystal lattice, creating “holes” that allow for electrical conduction.

P-Type Conductivity: Characterized by higher hole concentration, which facilitates positive charge flow.

Crystal Structure: Typically produced as single crystal wafers, ensuring uniformity and high purity.

Applications

Integrated Circuits (ICs): Used in the fabrication of microprocessors, memory chips, and analog devices, forming the basis for various electronic functionalities.

Solar Cells: Essential for photovoltaic technologies, particularly in creating p-n junctions when combined with N-type silicon, which enhances light absorption and energy conversion.

Transistors: Commonly used in bipolar junction transistors (BJTs), which amplify signals and switch electronic currents.

Diodes: Found in various types of diodes, including rectifiers and light-emitting diodes (LEDs), utilizing their p-n junction properties for efficient operation.

Sensors: Integral to the development of various sensors, including temperature sensors, pressure sensors, and gas sensors.

MEMS Devices: Employed in microelectromechanical systems, which are used for applications ranging from automotive to consumer electronics.

 

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