Titanium Silicide Lumps
Titanium Silicide Lumps
Titanium Silicide Lumps | |
Product No | NRE-11265 |
CAS | 12039-83-7 |
Purity | 99.9 % |
APS | 5 mm- 50 mm |
Molecular Weight | 104.038 g/mol |
Density | 4.02 g/cm³ |
Color | Black |
Molecular Formula | TiSi2 |
Melting Point | 1470 °C |
Boiling Point | NA |
Titanium Silicide Lumps
Titanium Silicide Powder
Applications
Semiconductor Industry:
Titanium silicide powder lumps are widely used in the semiconductor industry, especially in the production of metal silicides. These materials are used to form the contacts and interconnections in integrated circuits (ICs) and microelectronic devices.
TiSi₂ is particularly useful for contact metallization in silicon-based semiconductors, providing low-resistance electrical contacts that are essential for high-speed devices. These materials are commonly used in the fabrication of transistors and microprocessors.
The material’s high conductivity and stable electrical properties at high temperatures make it an ideal candidate for advanced semiconductor fabrication processes.
Aerospace and High-Temperature Applications:
Titanium silicide is utilized in aerospace applications, particularly in the manufacture of aircraft components, engine parts, and high-temperature materials. The material’s thermal stability, strength, and resistance to oxidation make it perfect for use in environments where extreme temperatures are encountered.
The compound is often used in heat shields, nozzles, and exhaust systems where high performance is needed under intense thermal stress.
Electrical and Electronic Components:
Titanium silicide lumps are used in the production of high-power electrical components, such as resistors, capacitors, and electrical contacts. Its high electrical conductivity makes it suitable for power transmission and electrical contact applications.
In power electronics, TiSi₂ is used to enhance the efficiency and performance of power switching devices and high-current circuits.
Thin Film Deposition:
Titanium silicide is used in the deposition of thin films for electronic devices, such as flat-panel displays, solar cells, and optical coatings. Its ability to form smooth, conductive films is crucial for these applications.
It is also used in sputtering targets for the deposition of titanium silicide thin films, which are then used in the manufacture of microelectronic circuits.
Catalysts and Chemical Processing:
Titanium silicide lumps have been explored as potential catalysts in various chemical reactions, particularly in processes that involve high temperatures and reactive chemicals. Its stability and resistance to corrosion make it a candidate for use in catalytic reactions, such as those in the petrochemical industry.
TiSi₂ can serve as a catalyst support material in processes like hydrogenation and oxidation, helping to enhance reaction rates in industrial applications.
Optoelectronics and Photonic Devices:
Titanium silicide is utilized in the field of optoelectronics for the development of photonics devices. The material’s ability to conduct electricity while being.
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