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Lead Sputtering Target

Lead Sputtering Target

Lead Sputtering Target
Product No NRE-43085
CAS No. 7439-92-1
Formula Pb
Molecular Weight 207.2 g/mol
Purity >99.9%
Density 11.34 g/cm³
Thickness 3 mm ± 0.5mm (can be suctomized)
Diameter 50 mm ± 1mm (can be customized)
Shape Round
Resistivity NA
Thermal Expansion NA

Lead Sputtering Target

Electronics

Conductive Films: Lead sputtering target is used to create conductive films in circuit boards and electronic components.

Resistors and Capacitors: Lead films enhance performance in passive electronic components.

 Optical Coatings

Anti-Reflective Coatings: Used on lenses and mirrors to minimize reflection and improve transmission.

Optical Filters: Tailored lead coatings can selectively filter specific wavelengths of light.

Soldering Materials

Lead-Alloy Solder: Lead is a key component in traditional solder used for electronic connections, providing excellent electrical conductivity and low melting points.

 Radiation Shielding

X-ray and Gamma-ray Protection: Lead’s high density makes it effective for shielding in medical and industrial applications, such as X-ray rooms and nuclear facilities.

Thin Film Batteries

Lead-Acid Batteries: Sputtered lead films can be used in components of lead-acid batteries, enhancing their performance and efficiency.

 Corrosion-Resistant Coatings

Protective Coatings: Lead can be applied to metals to create corrosion-resistant surfaces, extending the lifespan of equipment in harsh environments.

Magnetic Materials

Magnetic Film Deposition: Lead can be used in the deposition of thin films for magnetic applications in sensors and data storage devices.

Thermal Management

Heat Sinks: Lead films may be used in thermal management systems to enhance heat dissipation in electronic devices.

Plating and Coating

Surface Coatings: Lead can be applied to improve surface properties, such as wear resistance and lubricity.

 

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