Tin Tantalate Sputtering Targets
Tin Tantalate Sputtering Targets
| Tin Tantalate Sputtering Targets | |
| Product No | NRE-43574 |
| CAS No. | NA |
| Formula | SnTa2O6 |
| Molecular Weight | NA |
| Purity | >99.9% |
| Density | NA |
| Thickness | 3 mm ± 0.5mm (can be customized) |
| Diameter | 50 mm ± 1mm (can be customized) |
| Shape | Round |
| Resistivity | NA |
| Thermal Conductivity | NA |
Tin Tantalate Sputtering Targets
Introduction
Tin tantalate sputtering targets is a compound that combines tin oxide and tantalum oxide. It exhibits unique electrical, optical, and dielectric properties, making it a valuable material in various advanced applications. Tin tantalate is often utilized in thin-film deposition through sputtering, which allows for the precise control of film thickness and composition.
Applications
Dielectric Materials:
Tin tantalate is used in the fabrication of dielectric layers for capacitors and other electronic components. Its high dielectric constant and stability make it suitable for high-performance electronic applications.
Optoelectronic Devices:
Due to its optical properties, SnTaO₃ can be employed in optoelectronic devices such as light-emitting diodes (LEDs) and photodetectors. It is particularly useful in applications requiring high transparency and efficient light absorption.
Ferroelectric Applications:
Tin tantalate exhibits ferroelectric properties, making it suitable for use in ferroelectric random access memory (FeRAM) and other non-volatile memory technologies. Its ability to maintain polarization is valuable in memory applications.
Thin-Film Transistors (TFTs):
Tin tantalate can be utilized in thin-film transistors, which are critical components in display technologies, providing improved electrical performance and stability.
Piezoelectric Devices:
The piezoelectric properties of SnTaO₃ make it suitable for applications in sensors and actuators, where mechanical stress can be converted to electrical signals and vice versa.
Catalytic Applications:
Tin tantalate can also be explored as a catalyst or catalyst support in various chemical reactions, particularly in photocatalytic processes for environmental remediation.
Sputtering Process
The sputtering process for tin tantalate involves using a SnTaO₃ target in a vacuum chamber. When bombarded with energetic ions, atoms from the target are ejected and deposited onto a substrate, forming a thin film.
