Gold Tin Alloy Powder

Gold Tin Alloy Powder

Introduction

Gold-Tin (Au-Sn) alloy powder is a high-performance material composed primarily of gold (Au) and tin (Sn). This alloy is widely used in applications that demand excellent electrical conductivity, thermal stability, wettability, and corrosion resistance. Gold, known for its outstanding conductivity and resilience in harsh environments, and tin, a softer and more affordable metal, combine to form an alloy that offers unique advantages for high-precision applications, especially in the fields of electronics, semiconductors, and soldering.

Gold-Tin alloys are typically available in powder form, which is produced through processes such as atomization or milling. This powder can be used for various manufacturing processes, particularly in industries requiring fine, precise material applications. The alloy’s powder form is particularly useful for advanced electronics manufacturing, soldering applications, and high-reliability connections in semiconductors and aerospace technologies.

The proportion of gold to tin in the alloy can vary, with common ratios including 80% gold/20% tin, 60% gold/40% tin, and 50% gold/50% tin, depending on the specific requirements of the application. These alloys are typically used when a low melting point and high bonding strength are essential, such as in the bonding of semiconductor chips to substrates in flip-chip or wire bonding processes. The alloy also provides exceptional resistance to oxidation, which is crucial for maintaining performance over long periods, particularly in harsh environments.